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Found website easy to use and manual very clear. First class service
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The quality is quite good and clear. Nothing of the informations inside is lost during the digitalizing process
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Very good service, fast downloads and good manuals.
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Good qulity. Even as it is an old manual (from 1991-1992) it has a good scanned quality and is complete, including user's manual, disassembly intructions, diagrams and schematics, ajustments, troubleshooting and parts list, as usual with SONY manuals and Owner-manuals service.
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tres bon document
cela a permis de verifier la connection de l'ecran
merci
salutations
With Soldering Iron: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)
soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.
Hot Air Blower
Flat Pack-IC
Desoldering Braid
Soldering Iron Fig. S-1-3
or
(2) Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine.(Fig. S-1-4)
To Solid Mounting Point
Iron Wire Soldering Iron
Fig. S-1-5
Sharp Pin Fine Tip Soldering Iron
CBA
Fine Tip Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. (3) While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5. (4) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply
Flat Pack-IC Tweezers Fig. S-1-6
3-2
L6115STA
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