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It's a good manual, this one it's a scan from the original factory service manual, great quality 100% readeable. definetely it worths what I paid for.
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A good manual! fast service and good qualityi for pdf document.
thanks!
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Very helpful and complete manual. Maybe only one negative is schematics have sometimes unreadable name of the parts. But it's not a big problem.
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Excellent high quality schematics brought my old Heidelberg back to life. Fast download at a reasonable price. Thanks.
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This document is just what I was looking for, it´s very useful, it contains adjustment procedures for the final stage of the power amp and also
has a complete wiring diagram and description of the main semiconductors used in the design.
With Soldering Iron: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)
soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (5) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) Note: When using a soldering iron, care must be taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.
Hot Air Blower
Flat Pack-IC
Desoldering Braid
Soldering Iron Fig. S-1-3
or
(2) Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine.(Fig. S-1-4)
To Solid Mounting Point
Iron Wire Soldering Iron
Fig. S-1-5
Sharp Pin Fine Tip Soldering Iron
CBA
Fine Tip Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6) (4) Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6) With Iron Wire: (1) Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3) (2) Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5. (3) While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5. (4) Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply
Flat Pack-IC Tweezers Fig. S-1-6
3-2
L6115STA
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