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If you do not fill with solder and directly cut the IC lead with the cutter, stress may build up directly in the P.C.board�s pattern. If you do not fill with large quantities of solder as in step 1 the P.C.board pattern may be removed.
2. Using a cutter, cut the lead at the source. (Cut the contents with the cutter lightly 5 or 6 times.)
3. Remove when the solder melts. (Remove the lead at the same time.)
After removing the Flat IC and when attaching the new IC, remove any of the excess solder on the land using the soldering wire, etc. If the excess solder is not removed from the land, the IC will slip and not be attached properly.
10.3. FLAT PACKAGE IC INSTALLATION PROCEDURE 1. Temporary fix FLAT PACKAGE IC by soldering on two marked
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