The service manual is as described and received the link to the download sooner than expected. Great service, quality product. This site is a big help in the electronics repair business.
I ordered this manual sometime in the afternoon and I received it on my e-mail the same evening.
This is a fantastically good and properly scanned copy of the original manual. All pages are of the same scale and they overlap each other. It means that you can print the manual and easily make it as a convenient paper manual.
The content of the manual is fantastic. Alignment descriptions, PCB layouts and elementary diagrams are explicit and precise. I immediately found what I was looking for. Thanks to this manual and Owner-Manuals.com my amplifier is alive again. Many thanx indded!
Text excerpt from page 48 (click to view)
KX-TG1032B/KX-TGA101B
9.5.
9.5.1.
How to Replace the LLP (Leadless Leadframe Package) IC
Preparation
� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Hot Air Desoldering Tool Temperature: 608°F ± 68°F (320°C ± 20°C)
9.5.2.
Caution
� To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. � Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
9.5.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the P. C. board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely. Note: � Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the P. C. board.
3. After removing the IC, clean the P. C. board of residual solder.
