SERVICE MANUAL LIQUID CRYSTAL DIGITAL CAMCORDER PAL MODELS VL-SD20S/H/E
LIQUID CRYSTAL DIGITAL CAMCORDER
PAL
MODELS VL-SD20S/H/E
In the interests of user-safety (Required by safety regulations in some countries) the set should be restored to its original condition and only parts identical to those specified be used.
CONTENTS
Page 1. SPECIFICATIONS ........................................................................................................................... 1-1 2. PART NAMES .................................................................................................................................. 2-1 3. DISASSEMBLY OF THE SET ......................................................................................................... 3-1 4. MECHANISM ADJUSTMENT JIGS AND PARTS ...........................................................................4-1 5. INSPECTION AND MAINTENANCE ITEMS AND INTERVALS ................................................................................................................ 5-1 6. MECHANICAL ADJUSTMENTS AND CHECKS .............................................................................6-1 7. TAPE RUNNING ADJUSTMENT ..................................................................................................... 7-1 8. MECHANICAL SECTION ASSEMBLY AND PARTS REPLACEMENT (DISASSEMBLY AND REASSENBLY) ........................................................................................... 8-1 9. ADJUSTING THE ELECTRICAL CIRCUITS ................................................................................... 9-1 10.USEFUL TIPS ................................................................................................................................ 10-1 11.SIGNAL FLOW DIAGRAMS .......................................................................................................... 11-1 12.BLOCK DIAGRAMS ...................................................................................................................... 12-1 13.SCHEMATIC DIAGRAMS .............................................................................................................. 13-1 14.SEMICONDUCTOR LEAD IDENTIFICATION ............................................................................... 14-1 15.PRINTED WIRING BOARD ASSEMBLIES ................................................................................... 15-1 16.REPLACEMENT PARTS LIST....................................................................................................... 16-1 17.PACKING OF THE SET ................................................................................................................. 17-1
